About » Program Committee

Executive Technical Program Committee

Azadeh Ansari
Georgia Institute of Technology
USA

Lourdes Basabe
University of the Basque Country
SPAIN

Amar Basu
Wayne State University
USA

Sunil Bhave
Purdue University
USA

Victor Javier Cadarso Busto
Monash University
AUSTRALIA

Cristina Consani
Silicon Austria Labs GmbH
AUSTRIA

Maria Lucia Curri
Dept. Chemistry University of Bari
ITALY

Jaap Den Toonder
Eindhoven University of Technology
NETHERLANDS

Kristen Dorsey
Northeastern University
USA

Klaus Stefan Drese
Coburg University of Applied Sciences
GERMANY

Philip Feng
University of Florida
USA

Irene Fernandez-Cuesta
Universität Hamburg
GERMANY

Eiji Iwase
Waseda University
JAPAN

Hanseup Kim
University of Utah
USA

Yi-Kuen Lee
Hong Kong Univ. of Science and Tech.
HONG KONG

Frank Niklaus
KTH Royal Institute of Technology
SWEDEN

Troy Olsson
University of Pennsylvania
USA

Inkyu Park
KAIST
KOREA (ROK)

José Antonio Plaza
Inst. de Microelectrónica de Barcelona
SPAIN

Debbie Senesky
Stanford University
USA

Kenichi Takahata
University of British Columbia
CANADA

Oscar Vazquez Mena
UC San Diego
USA

Guillermo Villanueva
EPFL NEMS
SWITZERLAND

Fei Wang
Southern Univ. of Science and Tech.
CHINA

Yoko Yamanishi
Kyushu University
JAPAN

Da-Jeng Yao
National Tsing Hua University
TAIWAN

Eric Yeatman
Imperial College London
UK

Qingxin Zhang
A*STAR, Institute of Microelectronics
SINGAPORE

Rong Zhu
Tsinghua University
CHINA

Technical Program Committee

Mekhail Anwar
UC San Francisco and UC Berkeley
USA

Alba Avila
Universidad de los Andes
COLOMBIA

Behraad Bahreyni
Simon Fraser University
CANADA

Philippe Basset
Univ Gustave Eiffel / ESYCOM lab
FRANCE

Sarah Bedair
US Army Research Laboratory
USA

Alper Bozkurt
North Carolina State University
USA

Maide Bucolo
University of Catania
ITALY

Hung Cao
UC Irvine
USA

Cristian Cassella
Northeastern University
USA

Rakesh Chand
VIS-Singapore
SINGAPORE

Hengky Chandrahalim
The U.S. Air Force Institute of Technology
USA

Honglong Chang
Northwestern Polytechnical University
CHINA

Mu Chiao
The University of British Columbia
CANADA

Yi Chiu
National Yang Ming Chiao Tung University
TAIWAN

Hanna Cho
The Ohio State University
USA

Seokheun "Sean" Choi
State University of New York at Binghamton
USA

Eugene Chow
PARC, a Xerox Company
USA

Cheng-Hsin Chuang
National Sun Yat-sen University
TAIWAN

Elisabetta Comini
University of Brescia
ITALY

Caroline Coutier
CEA Leti
FRANCE

Alfons Dehe
Hahn-Schickard
GERMANY

Annalisa de Pastina
Silicon Austria Labs
AUSTRIA

Daniela Diaz-Alonso
Center for Engineering and Ind. Development
MEXICO

Sam Emaminejad
University of California Los Angeles
USA

Olivier Francais
Université Gustave Eiffel, ESIEE Paris
FRANCE

Paddy French
TU Delft
NETHERLANDS

Gerald Gerlach
TU Dresden, IFE
GERMANY

Mayur Ghatge
Broadcom
USA

Einar Halvorsen
University of South-Eastern Norway
NORWAY

Takeshi Hayakawa
Chuo University
JAPAN

Naoki Inomata
Tohoku University
JAPAN

Tadashi Ishida
Tokyo Institute of Technology
JAPAN

Mehdi Javanmard
Rutgers University New Brunswick
USA

Tetsuo Kan
The University of Electro-Communications
JAPAN

Jochen Kieninger
University of Freiburg
GERMANY

Sohee Kim
Daegu Gyeongbuk Inst. of Science and Tech.
KOREA (ROK)

Michael Kraft
KU Leuven
BELGIUM

Katsuo Kurabayashi
University of Michigan
USA

Amit Lal
Cornell University
USA

Chung Hoon Lee
Marquette University
USA

Joshua Lee
Institute of Microelectronics
SINGAPORE

Elie Lefeuvre
University of Paris-Saclay
FRANCE

Thierry Leichle
CNRS
USA

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Thomas Li
NXP Semiconductors
USA

Wei-Chang Li
National Taiwan University
TAIWAN

Wen Li
Michigan State University
USA

Chih-Ting Lin
National Taiwan University
TAIWAN

Jing-Quan Liu
Shanghai Jiao Tong University
CHINA

Xinyu Liu
University of Toronto
CANADA

Cristina Martin Olmos
EPFL
SWITZERLAND

Graf Markus
Karlsruhe University of Applied Sciences
GERMANY

Massimo Mastrangeli
Delft University of Technology
NETHERLANDS

Ignacio Matias
Public University of Navarra
SPAIN

Edgar Jan Mehner
Technical University Chemnitz
GERMANY

Matteo Montagnese
Silicon Austria Labs GmbH
AUSTRIA

Masanori Muroyama
Tohoku Institute of Technology
JAPAN

Stefan Palzer
TU Dortmund
GERMANY

Jae Yeong Park
Kwangwoon University
KOREA (ROK)

Jungyul Park
Sogang University
KOREA (ROK)

Woo-Tae Park
Seoul Tech
KOREA (ROK)

Gianluca Piazza
CMU
USA

Jaka Pribosek
Silicon Austria Labs
AUSTRIA

Niels Quack
University of Sydney
AUSTRALIA

Long Que
Iowa State University
USA

Swaminathan Rajaraman
University of Central Florida
USA

Robert Roberts
The University of Texas at El Paso
USA

Shinya Sakuma
Kyushu University
JAPAN

Jeronimo Segovia-Fernandez
Texas Instruments, Kilby Labs
USA

Ravi Selvaganapathy
McMaster University
CANADA

Vincent Senez
CNRS
FRANCE

Pietro Siciliano
IMM-CNR
ITALY

Tiina Sikanen
University of Helsinki
FINLAND

Göran Stemme
KTH - Royal Institute of Technology
SWEDEN

Dimitris Tsoukalas
National Technical Univ. of Athens
GREECE

Michael Vellekoop
University of Bremen
GERMANY

Junbo Wang
Aerospace Information Research Inst., CAS
CHINA

Zenghui Wang
University of Electronic Science and Tech.
CHINA

Zuankai Wang
City University of Hong Kong, China
CHINA

Dana Weinstein
Purdue University
USA

Carolyn White
AMFitzgerald
USA

Remco Wiegerink
University of Twente
NETHERLANDS

Min-Hsien Wu
Chang Gung University
TAIWAN

Tao Wu
ShanghaiTech University
CHINA

Huikai Xie
Beijing Institute of Technology
CHINA

Pengcheng Xu
Shanghai Institute of Microsystem & IT, CAS
CHINA

Daisuke Yamane
Ritsumeikan University
JAPAN